Rogers 50mil Substrate RO3206 PCB 2-layer with White silkscreen

This PCB utilizing Rogers RO3206, a ceramic-filled laminate reinforced with woven fiberglass, is engineered to deliver exceptional electrical performance and enhanced mechanical stability. As a 2-layer rigid structure, it reliably fulfills the stringent requirements for high-frequency signal transmission in precision RF applications, including automotive collision avoidance systems, wireless telecommunications infrastructure, and microstrip patch antenna assemblies.

PCB Specifications

PCB Stack-up

Rogers RO3206 Material Introduction

Rogers RO3206 high-frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass, specifically engineered to balance exceptional electrical performance, enhanced mechanical stability, and competitive pricing. As an extension of the RO3000 series, RO3206 distinguishes itself with improved mechanical stability, addressing the critical requirements of complex high-frequency circuit designs.

Its well-balanced electrical and mechanical properties make RO3206 highly suitable for a broad spectrum of high-frequency applications. It ensures reliable performance in demanding operating environments while enabling cost-effective volume manufacturing, catering to the mass production needs of industrial and automotive RF systems.

Key Material Features

Core Benefits

Enhanced Mechanical Rigidity: Woven glass reinforcement enhances structural rigidity, facilitating handling during manufacturing and assembly, and improving processability.

Uniform Electrical & Mechanical Performance: Consistent property distribution across the substrate, ideal for fabricating complex multi-layer high-frequency structures with reliable performance.

Low Dielectric Loss: A dissipation factor of 0.0027 at 10 GHz ensures superior signal integrity in high-frequency operations, minimizing signal attenuation.

Copper-Matched CTE: In-plane thermal expansion coefficient (13 ppm/°C for X/Y axes) matched to copper, enabling compatibility with epoxy multi-layer board hybrid designs and ensuring reliable surface mount assembly (SMA) under thermal cycling.

Excellent Dimensional Stability: Maintains structural precision during manufacturing and service, contributing to high production yields and long-term operational reliability.

Cost-Effective Volume Production: Economical pricing combined with mature processing compatibility supports cost-efficient mass manufacturing.

Precise Line Etching Capability: Smooth substrate surface enables finer line etching tolerances, meeting the high-precision requirements of advanced RF circuit designs.

Low Environmental Sensitivity: Moisture absorption ≤0.1% mitigates performance degradation in humid operating environments, ensuring stable performance across diverse application scenarios.

Quality Standard & Availability

Accepted Standard: Complies with IPC-Class-2, ensuring consistent product quality through strict manufacturing process control and 100% electrical testing before shipment.

Availability: Supports global supply, enabling timely delivery and efficient after-sales support for customers worldwide.

Typical Applications

Automotive collision avoidance systems

Automotive global positions satellite antennas

Wireless telecommunications systems

Microstrip patch antennas for wireless communications

Direct broadcast satellites

Datalink on cable systems

Remote meter readers

Power backplanes

LMDS and wireless broadband

Base station infrastructure