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RO3006 PCB 5mil Double-Sided with Pure gold 30u"

RO3006 PCB 5mil Double-Sided with Pure gold 30u"

MOQ: 1 stks
Prijs: USD9.99-99.99
Standaardverpakking: Vacuümzakken+dozen
Leveringstermijn: 8-9 werkdagen
Betalingswijze: T/t
Toeleveringskapaciteit: 5000 pcs per maand
Gedetailleerde informatie
Plaats van herkomst
CHINA
Merknaam
Bicheng
Certificering
UL, ISO9001, IATF16949
Modelnummer
BIC-052.v1.0
Basismateriaal:
Rogers RO3006
Lagen tellen:
2-laags
PCB -dikte:
0,2 mm
PCB -maat:
20 mm x 25 mm
Kopergewicht:
1oz (gelijkwaardig aan 1,4 mil of 35 μm)
Oppervlakte -afwerking:
Puur goud 30u"
Markeren:

Rogers PCB board 5mil double-sided

,

RO3006 PCB pure gold plating

,

double-sided PCB with 30u gold

Productbeschrijving
RO3006 PCB 5mil Double-Sided with Pure gold 30u"

This 2-layer rigid PCB is tailored for high-performance commercial microwave and RF applications, utilizing the superior electrical and mechanical stability of Rogers RO3006 ceramic-filled PTFE composite laminates. Thanks to its ultra-compact size, precise manufacturing specifications, and consistent performance across temperature changes, it's an optimal choice for space-limited and temperature-sensitive high-frequency electronic systems.

 

1. PCB Specifications

The PCB’s construction is optimized for precision, miniaturization, and compatibility with high-frequency operational demands, with key parameters outlined as follows:

Parameter Specification
Base Material Rogers RO3006 (ceramic-filled PTFE composite laminate)
Layer Count 2 layers (top and bottom outer copper layers)
Board Dimensions 20mm × 25mm per unit (1PCS)
Minimum Trace/Space 5 mils (trace width) / 9 mils (trace spacing)
Minimum Hole Size 0.2mm; no blind vias supported
Finished Board Thickness 0.2mm
Finished Copper Weight (Outer Layers) 1oz (equivalent to 1.4 mils or 35μm)
Via Plating Thickness 20μm
Surface Finish Pure gold 30u" (specifically designed for wire bonding applications, ensuring excellent conductivity and bonding reliability)
Silkscreen No
Solder Mask No
Quality Assurance 100% electrical testing conducted prior to shipment (effectively eliminating open/short circuit issues and ensuring operational reliability)

 

2. PCB Stack-up Configuration

Layer Thickness Function
Top Copper Layer (Copper_layer_1) 35μm Serves as the primary layer for high-frequency signal traces and top-side SMT pads, ensuring efficient signal transmission
Rogers RO3006 Substrate 5 mils (0.127mm) Acts as the dielectric core, providing exceptional electrical stability across temperature ranges to support reliable microwave and RF performance
Bottom Copper Layer (Copper_layer_2) 35μm Facilitates ground plane setup, additional signal routing, or thru-hole component connections, enhancing overall circuit functionality

 

3. Quality Standards & Global Availability

 

Artwork Format: Gerber RS-274-X (the universal industry standard for PCB manufacturing)

 

Accepted Quality Standard: IPC-Class-2 (meets strict requirements for performance, durability, and consistency)

 

Availability: Globally accessible (support projects across different countries and regions)

 

RO3006 PCB 5mil Double-Sided with Pure gold 30u" 0

 

4. Rogers RO3006 Substrate: Introduction, Features & Benefits

 

4.1 Introduction to Rogers RO3006

Rogers RO3006 laminates are high-performance ceramic-filled PTFE composites developed to deliver outstanding electrical and mechanical stability. A key advantage is their stable dielectric constant (Dk) across a wide temperature range, which eliminates the typical step change in Dk that affects standard PTFE glass materials near room temperature. This characteristic ensures consistent performance, making it a preferred choice for demanding microwave and RF systems.

 

4.2 Key Features of Rogers RO3006

Property Value Significance
Material Composition Ceramic-filled PTFE composite Balances low signal loss with excellent mechanical strength
Dielectric Constant (Dk) 6.15 ± 0.15 at 10 GHz / 23°C Tight tolerance ensures predictable signal propagation and consistent performance
Dissipation Factor 0.002 at 10 GHz / 23°C Ultra-low signal loss critical for maintaining signal integrity in high-frequency applications
Decomposition Temperature (Td) >500°C High thermal resistance suitable for harsh high-temperature environments
Thermal Conductivity 0.79 W/mK Efficient heat dissipation protects sensitive components and prevents overheating
Moisture Absorption 0.02% Minimal water uptake ensures stable performance in humid conditions
Coefficient of Thermal Expansion (CTE) X-axis 17 ppm/°C, Y-axis 17 ppm/°C, Z-axis 24 ppm/°C (measured from -55°C to 288°C) Low in-plane expansion matches copper, reducing thermal stress on PCB and components

 

4.3 Core Benefits of Rogers RO3006

These features translate to tangible advantages for both circuit design and end-use performance:

 

Uniform Mechanical Properties Across Dielectric Constants: Compatible with a range of dielectric constants, making it ideal for multi-layer board designs and hybrid assemblies with epoxy glass multi-layer boards, enhancing design flexibility

 

Low In-Plane Expansion Coefficient (Copper-Matched): Matches the expansion coefficient of copper, enabling more reliable surface-mounted assemblies, suitable for temperature-sensitive applications, and ensuring excellent dimensional stability over temperature variations

 

Volume Manufacturing Compatibility: Supports high-volume production processes with economical laminate pricing, reducing overall production costs while maintaining high quality

 

5. Some Typical Applications

- Automotive radar applications

- Global positioning satellite antennas

- Cellular telecommunications systems - power amplifiers and antennas

- Patch antenna for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes

 

In short, this 2-layer Rogers RO3006 PCB features precise manufacturing, compliant quality, and a high-performance substrate, offering a cost-efficient and reliable solution for commercial microwave and RF applications. With its compact design, low signal loss, and temperature stability, it's ideal for next-gen high-frequency electronics development.

 

RO3006 PCB 5mil Double-Sided with Pure gold 30u" 1

producten
DETAILS VAN DE PRODUCTEN
RO3006 PCB 5mil Double-Sided with Pure gold 30u"
MOQ: 1 stks
Prijs: USD9.99-99.99
Standaardverpakking: Vacuümzakken+dozen
Leveringstermijn: 8-9 werkdagen
Betalingswijze: T/t
Toeleveringskapaciteit: 5000 pcs per maand
Gedetailleerde informatie
Plaats van herkomst
CHINA
Merknaam
Bicheng
Certificering
UL, ISO9001, IATF16949
Modelnummer
BIC-052.v1.0
Basismateriaal:
Rogers RO3006
Lagen tellen:
2-laags
PCB -dikte:
0,2 mm
PCB -maat:
20 mm x 25 mm
Kopergewicht:
1oz (gelijkwaardig aan 1,4 mil of 35 μm)
Oppervlakte -afwerking:
Puur goud 30u"
Min. bestelaantal:
1 stks
Prijs:
USD9.99-99.99
Verpakking Details:
Vacuümzakken+dozen
Levertijd:
8-9 werkdagen
Betalingscondities:
T/t
Levering vermogen:
5000 pcs per maand
Markeren

Rogers PCB board 5mil double-sided

,

RO3006 PCB pure gold plating

,

double-sided PCB with 30u gold

Productbeschrijving
RO3006 PCB 5mil Double-Sided with Pure gold 30u"

This 2-layer rigid PCB is tailored for high-performance commercial microwave and RF applications, utilizing the superior electrical and mechanical stability of Rogers RO3006 ceramic-filled PTFE composite laminates. Thanks to its ultra-compact size, precise manufacturing specifications, and consistent performance across temperature changes, it's an optimal choice for space-limited and temperature-sensitive high-frequency electronic systems.

 

1. PCB Specifications

The PCB’s construction is optimized for precision, miniaturization, and compatibility with high-frequency operational demands, with key parameters outlined as follows:

Parameter Specification
Base Material Rogers RO3006 (ceramic-filled PTFE composite laminate)
Layer Count 2 layers (top and bottom outer copper layers)
Board Dimensions 20mm × 25mm per unit (1PCS)
Minimum Trace/Space 5 mils (trace width) / 9 mils (trace spacing)
Minimum Hole Size 0.2mm; no blind vias supported
Finished Board Thickness 0.2mm
Finished Copper Weight (Outer Layers) 1oz (equivalent to 1.4 mils or 35μm)
Via Plating Thickness 20μm
Surface Finish Pure gold 30u" (specifically designed for wire bonding applications, ensuring excellent conductivity and bonding reliability)
Silkscreen No
Solder Mask No
Quality Assurance 100% electrical testing conducted prior to shipment (effectively eliminating open/short circuit issues and ensuring operational reliability)

 

2. PCB Stack-up Configuration

Layer Thickness Function
Top Copper Layer (Copper_layer_1) 35μm Serves as the primary layer for high-frequency signal traces and top-side SMT pads, ensuring efficient signal transmission
Rogers RO3006 Substrate 5 mils (0.127mm) Acts as the dielectric core, providing exceptional electrical stability across temperature ranges to support reliable microwave and RF performance
Bottom Copper Layer (Copper_layer_2) 35μm Facilitates ground plane setup, additional signal routing, or thru-hole component connections, enhancing overall circuit functionality

 

3. Quality Standards & Global Availability

 

Artwork Format: Gerber RS-274-X (the universal industry standard for PCB manufacturing)

 

Accepted Quality Standard: IPC-Class-2 (meets strict requirements for performance, durability, and consistency)

 

Availability: Globally accessible (support projects across different countries and regions)

 

RO3006 PCB 5mil Double-Sided with Pure gold 30u" 0

 

4. Rogers RO3006 Substrate: Introduction, Features & Benefits

 

4.1 Introduction to Rogers RO3006

Rogers RO3006 laminates are high-performance ceramic-filled PTFE composites developed to deliver outstanding electrical and mechanical stability. A key advantage is their stable dielectric constant (Dk) across a wide temperature range, which eliminates the typical step change in Dk that affects standard PTFE glass materials near room temperature. This characteristic ensures consistent performance, making it a preferred choice for demanding microwave and RF systems.

 

4.2 Key Features of Rogers RO3006

Property Value Significance
Material Composition Ceramic-filled PTFE composite Balances low signal loss with excellent mechanical strength
Dielectric Constant (Dk) 6.15 ± 0.15 at 10 GHz / 23°C Tight tolerance ensures predictable signal propagation and consistent performance
Dissipation Factor 0.002 at 10 GHz / 23°C Ultra-low signal loss critical for maintaining signal integrity in high-frequency applications
Decomposition Temperature (Td) >500°C High thermal resistance suitable for harsh high-temperature environments
Thermal Conductivity 0.79 W/mK Efficient heat dissipation protects sensitive components and prevents overheating
Moisture Absorption 0.02% Minimal water uptake ensures stable performance in humid conditions
Coefficient of Thermal Expansion (CTE) X-axis 17 ppm/°C, Y-axis 17 ppm/°C, Z-axis 24 ppm/°C (measured from -55°C to 288°C) Low in-plane expansion matches copper, reducing thermal stress on PCB and components

 

4.3 Core Benefits of Rogers RO3006

These features translate to tangible advantages for both circuit design and end-use performance:

 

Uniform Mechanical Properties Across Dielectric Constants: Compatible with a range of dielectric constants, making it ideal for multi-layer board designs and hybrid assemblies with epoxy glass multi-layer boards, enhancing design flexibility

 

Low In-Plane Expansion Coefficient (Copper-Matched): Matches the expansion coefficient of copper, enabling more reliable surface-mounted assemblies, suitable for temperature-sensitive applications, and ensuring excellent dimensional stability over temperature variations

 

Volume Manufacturing Compatibility: Supports high-volume production processes with economical laminate pricing, reducing overall production costs while maintaining high quality

 

5. Some Typical Applications

- Automotive radar applications

- Global positioning satellite antennas

- Cellular telecommunications systems - power amplifiers and antennas

- Patch antenna for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes

 

In short, this 2-layer Rogers RO3006 PCB features precise manufacturing, compliant quality, and a high-performance substrate, offering a cost-efficient and reliable solution for commercial microwave and RF applications. With its compact design, low signal loss, and temperature stability, it's ideal for next-gen high-frequency electronics development.

 

RO3006 PCB 5mil Double-Sided with Pure gold 30u" 1

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