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RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet
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RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet
  • Naam

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet

MOQ: 1 stks
Prijs: USD9.99-99.99
Standaardverpakking: Vacuümzakken + dozen
Leveringstermijn: 8-9 werkdagen
Betalingswijze: T/T
Toeleveringskapaciteit: 5000PCS per maand
Details Informatie
Productbeschrijving
Gedetailleerde informatie
Plaats van herkomst
China
Merknaam
Bicheng
Certificering
UL, ISO9001, IATF16949
Modelnummer
BIC-332.V1.0
Onderdeelnummer:
RT duroid 6202
Laminaat dikte:
0,005” (0,127 mm) +/- 0,0005” 0,020” (0,508 mm) +/- 0,0010” 0,030” (0,762 mm) +/- 0,0010”
Laminaat formaat:
12”X 18”(305mm X 457mm) 24”X 18”(610mm X 457mm)
Koperen gewicht:
Elektrolytisch afgezette koperfolie ½ oz. (18 µm) HH/HH 1 oz. (35 µm) H1/H1 gerolde koperfolie ½ oz.
Markeren:

RT duroid 6202 PCB material

,

high frequency copper clad laminate

,

duroid 6202 copper clad sheet

Productbeschrijving

RT/duroid 6202 is a high-frequency circuit material formulated as a low-loss, low-dielectric-constant laminate. It delivers superior electrical and mechanical properties essential for designing complex microwave structures that require both mechanical reliability and electrical stability.

 

The inclusion of limited woven glass reinforcement provides excellent dimensional stability (0.05 to 0.07 mils/inch), which often eliminates the need for double etching to achieve tight positional tolerances.

 

Cladding Options and Dielectric Thicknesses

Both electrodeposited and rolled copper foil cladding, ranging from ½ oz. to 2 oz./ft.², are available on dielectric thicknesses spanning 0.005" to 0.060" (0.127 to 1.524 mm).

 

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 0

 

Features and Benefits

  • Low Loss: Ensures excellent high-frequency performance
  • Tight εr and Thickness Control: Provides consistent electrical characteristics
  • Excellent Electrical and Mechanical Properties: Enables reliable circuit construction
  • Extremely Low Thermal Coefficient of Dielectric Constant: Maintains electrical stability across temperature variations
  • In-Plane Expansion Coefficient Matched to Copper: Enhances reliability for surface-mounted assemblies and plated through-holes
  • Very Low Etch Shrinkage: Improves precision in circuit fabrication

 

Typical Applications

  • Phased Array Antennas
  • Ground-Based and Airborne Radar Systems
  • Global Positioning System (GPS) Antennas
  • Power Backplanes
  • High-Reliability Complex Multilayer Circuits
  • Commercial Airline Collision Avoidance Systems
  • Beam Forming Networks

 

Property

Dielectric Constant ε

r

Typical Value

2.94 ± 0.04 [3]

Direction

Z

Units

 

-

Conditions

10GHz/23°C

Test Method

IPC-TM-650, 2.5.5.5
Dissipation Factor, TAN δ 0.0015 Z - 10 GHz/23°C IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr +5 Z ppm/°C

10 GHz

-50 to +150°C

 IPC-TM-650, 2.5.5.5
Volume Resistivity 106 Z Mohm cm A ASTM D257
Surface Resistivity 109 Z Mohm A ASTM D257
Tensile Modulus 1007 (146) X, Y MPa (kpsi)

 

23°C

 

ASTM D638
Ultimate Stress 30 (4.3) X, Y MPs (kpsi)
Ultimate Strain 4.9 X, Y %
Compressive Modulus 1035 (150) Z MPa (kpsi)   ASTM D638
Moisture Absorption 0.04 - %

D23/24

D48/50

IPC-TM-650, 2.6.2.1

ASTM D570
Thermal Conductivity 0.68 - W/m/K 80°C ASTM C518

Coefficient of Thermal

Expansion (-55 to 288 °C)

15

15

30

X

Y

Z

 

ppm/°C

 

23°C/50% RH

 IPC-TM-650 2.4.41
Dimensional Stability 0.07 X, Y mm/m (mil/inch) after etch +E/150 IPC-TM-650, 2.4.3.9
Td 500   °CTGA   ASTM D3850
Density 2.1   gm/cm3   ASTM D792
Specific Heat 0.93 (0.22) - J/g/K (BTU/lb/°F) - Calculated
Copper Peel 9.1 (1.6)   lbs/in (N/mm)   IPC-TM-650 2.4.8
Flammability V-O       UL 94
Lead-Free Process Com- patible YES        

 

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 1

Tags: 

0.1 mm kopergecoat laminaat,  

BME217 Koperbekleed laminaat,  

12 mm kopergecoat laminaat

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producten
DETAILS VAN DE PRODUCTEN
Producten

Rf-de Raad van PCB

De Raad van Rogerspcb

PTFE-de Raad van PCB

Hoge Tg-PCB

Multilaagpcb

Taconic PCB

HDI-de Raad van PCB

Hoge snelheidspcb

Impedantie Gecontroleerde PCB

Flexibele PCB-Raad

fr4 PCB-raad

PCB-stencil

PCB van de metaalkern

Laminaten van koper
RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet
  • Naam
RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet
MOQ: 1 stks
Prijs: USD9.99-99.99
Standaardverpakking: Vacuümzakken + dozen
Leveringstermijn: 8-9 werkdagen
Betalingswijze: T/T
Toeleveringskapaciteit: 5000PCS per maand
Gedetailleerde informatie
Productbeschrijving
Gedetailleerde informatie
Plaats van herkomst
China
Merknaam
Bicheng
Certificering
UL, ISO9001, IATF16949
Modelnummer
BIC-332.V1.0
Onderdeelnummer:
RT duroid 6202
Laminaat dikte:
0,005” (0,127 mm) +/- 0,0005” 0,020” (0,508 mm) +/- 0,0010” 0,030” (0,762 mm) +/- 0,0010”
Laminaat formaat:
12”X 18”(305mm X 457mm) 24”X 18”(610mm X 457mm)
Koperen gewicht:
Elektrolytisch afgezette koperfolie ½ oz. (18 µm) HH/HH 1 oz. (35 µm) H1/H1 gerolde koperfolie ½ oz.
Min. bestelaantal:
1 stks
Prijs:
USD9.99-99.99
Verpakking Details:
Vacuümzakken + dozen
Levertijd:
8-9 werkdagen
Betalingscondities:
T/T
Levering vermogen:
5000PCS per maand
Markeren

RT duroid 6202 PCB material

,

high frequency copper clad laminate

,

duroid 6202 copper clad sheet

Productbeschrijving

RT/duroid 6202 is a high-frequency circuit material formulated as a low-loss, low-dielectric-constant laminate. It delivers superior electrical and mechanical properties essential for designing complex microwave structures that require both mechanical reliability and electrical stability.

 

The inclusion of limited woven glass reinforcement provides excellent dimensional stability (0.05 to 0.07 mils/inch), which often eliminates the need for double etching to achieve tight positional tolerances.

 

Cladding Options and Dielectric Thicknesses

Both electrodeposited and rolled copper foil cladding, ranging from ½ oz. to 2 oz./ft.², are available on dielectric thicknesses spanning 0.005" to 0.060" (0.127 to 1.524 mm).

 

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 0

 

Features and Benefits

  • Low Loss: Ensures excellent high-frequency performance
  • Tight εr and Thickness Control: Provides consistent electrical characteristics
  • Excellent Electrical and Mechanical Properties: Enables reliable circuit construction
  • Extremely Low Thermal Coefficient of Dielectric Constant: Maintains electrical stability across temperature variations
  • In-Plane Expansion Coefficient Matched to Copper: Enhances reliability for surface-mounted assemblies and plated through-holes
  • Very Low Etch Shrinkage: Improves precision in circuit fabrication

 

Typical Applications

  • Phased Array Antennas
  • Ground-Based and Airborne Radar Systems
  • Global Positioning System (GPS) Antennas
  • Power Backplanes
  • High-Reliability Complex Multilayer Circuits
  • Commercial Airline Collision Avoidance Systems
  • Beam Forming Networks

 

Property

Dielectric Constant ε

r

Typical Value

2.94 ± 0.04 [3]

Direction

Z

Units

 

-

Conditions

10GHz/23°C

Test Method

IPC-TM-650, 2.5.5.5
Dissipation Factor, TAN δ 0.0015 Z - 10 GHz/23°C IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr +5 Z ppm/°C

10 GHz

-50 to +150°C

 IPC-TM-650, 2.5.5.5
Volume Resistivity 106 Z Mohm cm A ASTM D257
Surface Resistivity 109 Z Mohm A ASTM D257
Tensile Modulus 1007 (146) X, Y MPa (kpsi)

 

23°C

 

ASTM D638
Ultimate Stress 30 (4.3) X, Y MPs (kpsi)
Ultimate Strain 4.9 X, Y %
Compressive Modulus 1035 (150) Z MPa (kpsi)   ASTM D638
Moisture Absorption 0.04 - %

D23/24

D48/50

IPC-TM-650, 2.6.2.1

ASTM D570
Thermal Conductivity 0.68 - W/m/K 80°C ASTM C518

Coefficient of Thermal

Expansion (-55 to 288 °C)

15

15

30

X

Y

Z

 

ppm/°C

 

23°C/50% RH

 IPC-TM-650 2.4.41
Dimensional Stability 0.07 X, Y mm/m (mil/inch) after etch +E/150 IPC-TM-650, 2.4.3.9
Td 500   °CTGA   ASTM D3850
Density 2.1   gm/cm3   ASTM D792
Specific Heat 0.93 (0.22) - J/g/K (BTU/lb/°F) - Calculated
Copper Peel 9.1 (1.6)   lbs/in (N/mm)   IPC-TM-650 2.4.8
Flammability V-O       UL 94
Lead-Free Process Com- patible YES        

 

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 1

Tags: 

0.1 mm kopergecoat laminaat,

BME217 Koperbekleed laminaat,

12 mm kopergecoat laminaat

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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