F4BM275 Substrate High Frequency Laminates Copper Clad Sheet

The F4BM275 is manufactured through scientifically formulated and strictly controlled lamination processes using glass fabric, polytetrafluoroethylene resin, and PTFE film. Its electrical performance represents a certain improvement over F4B, primarily reflected in a wider dielectric constant range, lower dielectric loss, increased insulation resistance values, and enhanced performance stability. This product can effectively substitute for similar foreign products.

The F4BM and F4BME share the same dielectric layer but differ in the copper foil used: F4BM utilizes ED copper foil and is suitable for applications without PIM (Passive Intermodulation) requirements; F4BME utilizes reverse-treated RTF copper foil, offering excellent PIM performance, more precise circuit control, and lower conductor loss.

Both F4BM and F4BME achieve precise dielectric constant control by adjusting the ratio between PTFE resin and glass fabric. This formulation achieves low loss while enhancing material dimensional stability. A higher dielectric constant corresponds to a higher glass fiber ratio, resulting in better dimensional stability, lower coefficient of thermal expansion, and improved temperature drift characteristics, albeit with a slight increase in dielectric loss.

Product Features

• DK2.17 ～3 is optional, and DK can be customized
• Low loss
• F4BME with RTF copper foil delivers excellent PIM performance
• Diverse sizes for cost savings
• Radiation resistance and low outgassing
• Commercialized, mass-producible, and cost-effective

Typical Applications

• Microwave, RF, radar
• Phase shifters, passive components
• Power dividers, couplers, combiners
• Feeding networks, phased array antennas
• Satellite communications, base station antennas