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PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

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PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

MOQ:	1 stks
Prijs:	USD9.99-99.99
Standaardverpakking:	Vacuümzakken + dozen
Leveringstermijn:	8-9 werkdagen
Betalingswijze:	T/T
Toeleveringskapaciteit:	5000PCS per maand

Details Informatie

Productbeschrijving

Gedetailleerde informatie

Plaats van herkomst

China

Merknaam

Bicheng

Certificering

UL, ISO9001, IATF16949

Modelnummer

BIC-332.V1.0

Onderdeelnummer:

Tly-3

Laminaat dikte:

0,0035 inch; 0,0050 inch; 0,0075 inch; 0,0100 inch

Laminaat formaat:

12 x 18 inch (305 x 457 mm); 16 x 36 inch (406 x 914 mm); 16 x 18 inch (406 x 457 mm); 24 x 36 inch

Koperen gewicht:

1/2 oz. ED-koper; 1 oz. CL1 koper; 1 oz. C1 koper

Markeren:

PCB material TLY-3 laminate

high frequency copper clad sheet

TLY-3 copper clad laminate

Productbeschrijving

TLY-3 laminates are fabricated using ultra-lightweight woven fiberglass, offering significantly greater dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiberglass matrix delivers a mechanically robust laminate ideal for high-volume production. Featuring an extremely low dissipation factor, TLY-3 performs reliably in 77 GHz automotive radar systems and other millimeter-wave antenna designs.

Comparative OEM testing at 77 GHz between low-reinforcement TLY-3 and its nearest chopped fiber-reinforced competitor demonstrated comparable “drop-in” insertion loss and dielectric performance, with the key advantage of drastically improved manufacturing yields. The dielectric constant (Dk) ranges from 2.17 to 2.40. For most thicknesses, Dk can be specified at any value within this range with a tight tolerance of ±0.02. At 10 GHz, the typical dissipation factor (Df) in the low-Dk region is approximately 0.0009.

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet 0

Properties	Conditions	Typical Value	Unit	Test Method
Electrical Properties	Dielectric Constant @ 10 GHz	2.33 ± 0.02	-	IPC-650 2.5.5.5
	Dissipation Factor @ 10 GHz	0.0012	-	IPC-650 2.5.5.5
	Volume Resistivity (after elevated temp.)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Volume Resistivity (after humidity)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Surface Resistivity (after elevated temp.)	10⁸	Mohms	IPC-650 2.5.17.1
	Surface Resistivity (after humidity)	10⁸	Mohms	IPC-650 2.5.17.1
Thermal Properties	Thermal Conductivity	0.22	W/M*K	ASTM F 433
	CTE (25-260°C) - X	26	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Y	15	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Z	217	ppm/°C	ASTM D 3386 (TMA)
Mechanical Properties	Peel Strength - 1/2 oz. ED copper	1.96 (11)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. CL1 copper	2.86 (16)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. C1 copper	3.04 (17)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength (at elevated temp.)	2.32 (13)	N/mm (Ibs/in)	IPC-650 2.4.8
	Flexural Strength - MD	96.91 (14,057)	N/mm² (psi)	IPC-650 2.4.4
	Flexural Strength - CD	89.32 (12,955)	N/mm² (psi)	IPC-650 2.4.4
	Young’s Modulus - MD	9.65 X 10³ (1.4 X 10⁶)	N/mm² (psi)	ASTM D 3039 / IPC-650 2.4.19
	Poisson’s Ratio - MD	0.21	-	ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties	Density Specific Gravity	2.19	g/cm³	ASTM D 792
Mechanical Properties	Dimensional Stability - MD, 10 mil	-0.038	mm/M (mils/in)	IPC-650 2.4.39
Mechanical Properties	Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress)	-0.038	mm/M (mils/in)	-
Chemical / Physical Properties	Moisture Absorption	0.02	%	IPC-650 2.6.2.1
	NASA Outgassing - TML	0.01	%	-
	NASA Outgassing - CVCM	0.01	%	-
	NASA Outgassing - WVR	0.01	%	-
	UL-94 Flammability Rating	V-0	-	UL-94

Key Benefits

Excellent dimensional stability
Ultra-low dissipation factor (Df)
High peel strength
Low moisture absorption
Consistent, uniform dielectric constant (Dk)
Laser-ablatable

Target Applications

Automotive radar
Satellite and cellular communications
Power amplifiers
LNBs, LNAs, and LNCs
Aerospace systems
Ka-band, E-band, and W-band applications

Tags:

Producten

MOQ:	1 stks
Prijs:	USD9.99-99.99
Standaardverpakking:	Vacuümzakken + dozen
Leveringstermijn:	8-9 werkdagen
Betalingswijze:	T/T
Toeleveringskapaciteit:	5000PCS per maand

Gedetailleerde informatie

Productbeschrijving

Gedetailleerde informatie

Plaats van herkomst

China

Merknaam

Bicheng

Certificering

UL, ISO9001, IATF16949

Modelnummer

BIC-332.V1.0

Onderdeelnummer:

Tly-3

Laminaat dikte:

0,0035 inch; 0,0050 inch; 0,0075 inch; 0,0100 inch

Laminaat formaat:

12 x 18 inch (305 x 457 mm); 16 x 36 inch (406 x 914 mm); 16 x 18 inch (406 x 457 mm); 24 x 36 inch

Koperen gewicht:

1/2 oz. ED-koper; 1 oz. CL1 koper; 1 oz. C1 koper

Min. bestelaantal:

1 stks

Prijs:

USD9.99-99.99

Verpakking Details:

Vacuümzakken + dozen

Levertijd:

8-9 werkdagen

Betalingscondities:

T/T

Levering vermogen:

5000PCS per maand

Markeren

PCB material TLY-3 laminate

high frequency copper clad sheet

TLY-3 copper clad laminate

Productbeschrijving

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet 0

Properties	Conditions	Typical Value	Unit	Test Method
Electrical Properties	Dielectric Constant @ 10 GHz	2.33 ± 0.02	-	IPC-650 2.5.5.5
	Dissipation Factor @ 10 GHz	0.0012	-	IPC-650 2.5.5.5
	Volume Resistivity (after elevated temp.)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Volume Resistivity (after humidity)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Surface Resistivity (after elevated temp.)	10⁸	Mohms	IPC-650 2.5.17.1
	Surface Resistivity (after humidity)	10⁸	Mohms	IPC-650 2.5.17.1
Thermal Properties	Thermal Conductivity	0.22	W/M*K	ASTM F 433
	CTE (25-260°C) - X	26	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Y	15	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Z	217	ppm/°C	ASTM D 3386 (TMA)
Mechanical Properties	Peel Strength - 1/2 oz. ED copper	1.96 (11)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. CL1 copper	2.86 (16)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. C1 copper	3.04 (17)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength (at elevated temp.)	2.32 (13)	N/mm (Ibs/in)	IPC-650 2.4.8
	Flexural Strength - MD	96.91 (14,057)	N/mm² (psi)	IPC-650 2.4.4
	Flexural Strength - CD	89.32 (12,955)	N/mm² (psi)	IPC-650 2.4.4
	Young’s Modulus - MD	9.65 X 10³ (1.4 X 10⁶)	N/mm² (psi)	ASTM D 3039 / IPC-650 2.4.19
	Poisson’s Ratio - MD	0.21	-	ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties	Density Specific Gravity	2.19	g/cm³	ASTM D 792
Mechanical Properties	Dimensional Stability - MD, 10 mil	-0.038	mm/M (mils/in)	IPC-650 2.4.39
Mechanical Properties	Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress)	-0.038	mm/M (mils/in)	-
Chemical / Physical Properties	Moisture Absorption	0.02	%	IPC-650 2.6.2.1
	NASA Outgassing - TML	0.01	%	-
	NASA Outgassing - CVCM	0.01	%	-
	NASA Outgassing - WVR	0.01	%	-
	UL-94 Flammability Rating	V-0	-	UL-94

Key Benefits

Excellent dimensional stability
Ultra-low dissipation factor (Df)
High peel strength
Low moisture absorption
Consistent, uniform dielectric constant (Dk)
Laser-ablatable

Target Applications

Automotive radar
Satellite and cellular communications
Power amplifiers
LNBs, LNAs, and LNCs
Aerospace systems
Ka-band, E-band, and W-band applications

Tags:

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PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

PCB material TLY-3 laminate

high frequency copper clad sheet

TLY-3 copper clad laminate

0.1 mm kopergecoat laminaat,

BME217 Koperbekleed laminaat,

Rf-de Raad van PCB

De Raad van Rogerspcb

PTFE-de Raad van PCB

Hoge Tg-PCB

Multilaagpcb

Taconic PCB

HDI-de Raad van PCB

Hoge snelheidspcb

Impedantie Gecontroleerde PCB

Flexibele PCB-Raad

fr4 PCB-raad

PCB-stencil

PCB van de metaalkern

Laminaten van koper

PCB material TLY-3 laminate

high frequency copper clad sheet

TLY-3 copper clad laminate

0.1 mm kopergecoat laminaat,

BME217 Koperbekleed laminaat,