DETAILS VAN DE PRODUCTEN

Huis > Producten >

12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

Producten

PCB van de metaalkern

Neem contact met ons op

Ms. Ivy Deng

sales10@bichengpcb.com

86-755-27374847

Contact opnemen

12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

MOQ:	1 stks
Prijs:	USD9.99-99.99
Standaardverpakking:	Vacuümzakken+dozen
Leveringstermijn:	8-9 werkdagen
Betalingswijze:	T/T
Toeleveringskapaciteit:	5000 pcs per maand

Details Informatie

Productbeschrijving

Gedetailleerde informatie

Plaats van herkomst

China

Merknaam

Bicheng

Certificering

UL, ISO9001, IATF16949

Modelnummer

BIC-332.V1.0

Basismateriaal:

Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G)

Lagen tellen:

12 lagen

PCB -dikte:

2.12mm

PCB-grootte:

220 mm x 60 mm per eenheid (tolerantie: ±0,15 mm)

Zijdescherm:

Soldermasker:

Blauw

Kopergewicht:

Buitenste lagen (L1, L12): 1oz (1,4 mils / 35μm)Binnenste lagen: 0,5oz (0,7 mils / 17μm) of 1oz (35μ

Oppervlakteafwerking:

Elektroless nikkel Immersion Gold (Enig)

Markeren:

12-layer M6 PCB with ENIG

impedance control multilayer circuit board

high speed PCB with warranty

Productbeschrijving

12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

This 12-layer rigid PCB is engineered with Panasonic Megtron6 (M6) R-5775--an advanced high-speed, low-loss copper-clad laminate (CCL)--to deliver exceptional signal integrity and reliability for demanding high-frequency applications.

PCB Details

Parameter	Specification
Layer Count	12-layer rigid PCB
Base Material	Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G)
Board Dimensions	220mm x 60mm per unit (tolerance: ±0.15mm)
Finished Board Thickness	2.12mm
Copper Weight	Outer Layers (L1, L12): 1oz (1.4 mils / 35μm) Inner Layers: 0.5oz (0.7 mils / 17μm) or 1oz (35μm) (per stack-up)
Via Plating Thickness	25μm
Minimum Trace/Space	3 mils / 3 mils
Minimum Hole Size	0.2mm
Vias	459 total (no blind vias); 0.2mm & 0.4mm vias filled with resin + capped plating
Surface Finish	Electroless Nickel Immersion Gold (ENIG)
Silkscreen	Top (L1): White; Bottom (L12): White
Solder Mask	Top (L1): Blue; Bottom (L12): Blue
Quality Assurance	100% Electrical test prior to shipment
Artwork Format	Gerber RS-274-X
Quality Standard	IPC-Class-3

Precise PCB Stack-up

Layer Type	Specification	Thickness
Copper Layer (Outer Top - L1)	Copper_layer_1	35μm (1oz)
Prepreg	R-5670(G) 1080 (68%) × 1	81.4μm
Copper Layer (Inner - L2)	Copper_layer_2	35μm (1oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L3)	Copper_layer_3	17μm (0.5oz)
Prepreg	R-5670(G) 3313 (59%) × 2	219.9μm
Copper Layer (Inner - L4)	Copper_layer_4	17μm (0.5oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L5)	Copper_layer_5	17μm (0.5oz)
Prepreg	R-5670(G) 3313 (59%) × 2	216.5μm
Copper Layer (Inner - L6)	Copper_layer_6	35μm (1oz)
Megtron6 Core	M6 Core R5775G(HVLP)	400μm (thick core for stability)
Copper Layer (Inner - L7)	Copper_layer_7	35μm (1oz)
Prepreg	R-5670(G) 3313 (59%) × 2	215.6μm
Copper Layer (Inner - L8)	Copper_layer_8	17μm (0.5oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L9)	Copper_layer_9	17μm (0.5oz)
Prepreg	R-5670(G) 3313 (59%) × 2	219.8μm
Copper Layer (Inner - L10)	Copper_layer_10	17μm (0.5oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L11)	Copper_layer_11	35μm (1oz)
Prepreg	R-5670(G) 1080 (68%) × 1	81.4μm
Copper Layer (Outer Bottom - L12)	Copper_layer_12	35μm (1oz)

Critical Impedance Control (50 Ohm Single-Ended)

Impedance ID	Configuration	Layer	Trace Width	Reference Layers	Target Impedance
Impedance-1	Single-Ended	L1 (Top Outer)	5.71 mils	Down: L2	50 Ohms
Impedance-2	Single-Ended	L3 (Inner)	4.31 mils	Upper: L2; Down: L4	50 Ohms
Impedance-3	Single-Ended	L5 (Inner)	4.71 mils	Upper: L4; Down: L7	50 Ohms
Impedance-4	Single-Ended	L8 (Inner)	4.51 mils	Upper: L7; Down: L9	50 Ohms
Impedance-5	Single-Ended	L10 (Inner)	4.31 mils	Upper: L9; Down: L11	50 Ohms

Megtron6 (M6) R-5775 Material Overview

Panasonic Megtron6 (M6) R-5775 is a premium multilayer copper-clad laminate (CCL) engineered for high-frequency, high-speed, and high-reliability electronic systems. Designed to address the stringent demands of 5G, millimeter-wave, and high-performance computing (HPC) applications, it combines low dielectric loss (Df), stable dielectric constant (Dk), and exceptional thermal reliability--enabling seamless transmission of high-speed signals with minimal attenuation.

As a halogen-free, RoHS-compliant material, Megtron6 aligns with green manufacturing standards while supporting 4-30 layer PCB designs, making it versatile for complex circuit architectures. Its compatibility with traditional FR-4 processing technology eliminates the need for special equipment, reducing production costs without compromising performance.

Key Features of Megtron6 (M6) R-5775

Property	Specification
Dielectric Constant (Dk)	3.4 (1GHz/23°C); 3.34 (13GHz)
Dissipation Factor (Df)	0.002 (1GHz/23°C); 0.0037 (13GHz)
Coefficient of Thermal Expansion (CTE)	X-axis: 16 ppm/°C; Y-axis: 16 ppm/°C; Z-axis: 45 ppm/°C
Glass Transition Temperature (Tg)	>185°C (DSC method); 210°C (DMA method)
Thermal Decomposition Temperature (Td)	410°C (TGA method)
Layer Support	4-30 layer multilayer PCB designs
Environmental Compliance	RoHS-compliant; Halogen-free
Manufacturing Compatibility	Traditional FR-4 processing (no special equipment required)
Flammability Rating	UL 94 V-0

Typical Applications

This 12-layer Megtron6 PCB is tailored for high-performance, high-frequency systems across industries:

5G Communication: Millimeter-wave antennas, AAU (Active Antenna Unit) RF front-ends, and 5G base station hardware.
Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver-Assistance Systems), and autonomous driving sensors.
Data Centers: High-speed server motherboards, 400G/800G optical module PCBs, and high-bandwidth interconnects.
Aerospace & Defense: Satellite communication systems, high-frequency radar circuits, and avionics.
Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices, and high-performance computing peripherals.

Tags:

1oz medische apparatuurpcb,

1oz onderdompelings Gouden PCB,

PCB van de Tg150fr4 Medische apparatuur

Aanbevolen producten

M6 High Speed Low Loss PCB 6-laags 1,4 mm dik ENEPIG afwerking

Contact opnemen

AD1000 microwave pcb gebouwd op 50 mil substraten voor radar antenne

Contact opnemen

60.7mil RO4725JXR PCB-bord met ENIG op pads zonder bovenste of onderste zijdeplaat of soldeermasker

Contact opnemen

25mil RT Duroïde 6006 RF PCB met groen soldeermasker en onderdompeling goud

Contact opnemen

NT1 verpakking NT1 verpakking RT verpakking

Contact opnemen

M6 High Speed PCB Low Loss Multilayer 2mm Impedantiebord

Contact opnemen

Van de de Dikte94v-0 Lagen Classificatie van PCB 0.8mm van de onderdompelings Gouden 4 Hoge snelheid

Contact opnemen

DETAILS VAN DE PRODUCTEN

Producten

Rf-de Raad van PCB

De Raad van Rogerspcb

PTFE-de Raad van PCB

Hoge Tg-PCB

Multilaagpcb

Taconic PCB

HDI-de Raad van PCB

Hoge snelheidspcb

Impedantie Gecontroleerde PCB

Flexibele PCB-Raad

fr4 PCB-raad

PCB-stencil

PCB van de metaalkern

12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

MOQ:	1 stks
Prijs:	USD9.99-99.99
Standaardverpakking:	Vacuümzakken+dozen
Leveringstermijn:	8-9 werkdagen
Betalingswijze:	T/T
Toeleveringskapaciteit:	5000 pcs per maand

Gedetailleerde informatie

Productbeschrijving

Gedetailleerde informatie

Plaats van herkomst

China

Merknaam

Bicheng

Certificering

UL, ISO9001, IATF16949

Modelnummer

BIC-332.V1.0

Basismateriaal:

Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G)

Lagen tellen:

12 lagen

PCB -dikte:

2.12mm

PCB-grootte:

220 mm x 60 mm per eenheid (tolerantie: ±0,15 mm)

Zijdescherm:

Wit

Soldermasker:

Blauw

Kopergewicht:

Buitenste lagen (L1, L12): 1oz (1,4 mils / 35μm)Binnenste lagen: 0,5oz (0,7 mils / 17μm) of 1oz (35μ

Oppervlakteafwerking:

Elektroless nikkel Immersion Gold (Enig)

Min. bestelaantal:

1 stks

Prijs:

USD9.99-99.99

Verpakking Details:

Vacuümzakken+dozen

Levertijd:

8-9 werkdagen

Betalingscondities:

T/T

Levering vermogen:

5000 pcs per maand

Markeren

12-layer M6 PCB with ENIG

impedance control multilayer circuit board

high speed PCB with warranty

Productbeschrijving

12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

PCB Details

Parameter	Specification
Layer Count	12-layer rigid PCB
Base Material	Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G)
Board Dimensions	220mm x 60mm per unit (tolerance: ±0.15mm)
Finished Board Thickness	2.12mm
Copper Weight	Outer Layers (L1, L12): 1oz (1.4 mils / 35μm) Inner Layers: 0.5oz (0.7 mils / 17μm) or 1oz (35μm) (per stack-up)
Via Plating Thickness	25μm
Minimum Trace/Space	3 mils / 3 mils
Minimum Hole Size	0.2mm
Vias	459 total (no blind vias); 0.2mm & 0.4mm vias filled with resin + capped plating
Surface Finish	Electroless Nickel Immersion Gold (ENIG)
Silkscreen	Top (L1): White; Bottom (L12): White
Solder Mask	Top (L1): Blue; Bottom (L12): Blue
Quality Assurance	100% Electrical test prior to shipment
Artwork Format	Gerber RS-274-X
Quality Standard	IPC-Class-3

Precise PCB Stack-up

Layer Type	Specification	Thickness
Copper Layer (Outer Top - L1)	Copper_layer_1	35μm (1oz)
Prepreg	R-5670(G) 1080 (68%) × 1	81.4μm
Copper Layer (Inner - L2)	Copper_layer_2	35μm (1oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L3)	Copper_layer_3	17μm (0.5oz)
Prepreg	R-5670(G) 3313 (59%) × 2	219.9μm
Copper Layer (Inner - L4)	Copper_layer_4	17μm (0.5oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L5)	Copper_layer_5	17μm (0.5oz)
Prepreg	R-5670(G) 3313 (59%) × 2	216.5μm
Copper Layer (Inner - L6)	Copper_layer_6	35μm (1oz)
Megtron6 Core	M6 Core R5775G(HVLP)	400μm (thick core for stability)
Copper Layer (Inner - L7)	Copper_layer_7	35μm (1oz)
Prepreg	R-5670(G) 3313 (59%) × 2	215.6μm
Copper Layer (Inner - L8)	Copper_layer_8	17μm (0.5oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L9)	Copper_layer_9	17μm (0.5oz)
Prepreg	R-5670(G) 3313 (59%) × 2	219.8μm
Copper Layer (Inner - L10)	Copper_layer_10	17μm (0.5oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L11)	Copper_layer_11	35μm (1oz)
Prepreg	R-5670(G) 1080 (68%) × 1	81.4μm
Copper Layer (Outer Bottom - L12)	Copper_layer_12	35μm (1oz)

Critical Impedance Control (50 Ohm Single-Ended)

Impedance ID	Configuration	Layer	Trace Width	Reference Layers	Target Impedance
Impedance-1	Single-Ended	L1 (Top Outer)	5.71 mils	Down: L2	50 Ohms
Impedance-2	Single-Ended	L3 (Inner)	4.31 mils	Upper: L2; Down: L4	50 Ohms
Impedance-3	Single-Ended	L5 (Inner)	4.71 mils	Upper: L4; Down: L7	50 Ohms
Impedance-4	Single-Ended	L8 (Inner)	4.51 mils	Upper: L7; Down: L9	50 Ohms
Impedance-5	Single-Ended	L10 (Inner)	4.31 mils	Upper: L9; Down: L11	50 Ohms

Megtron6 (M6) R-5775 Material Overview

Key Features of Megtron6 (M6) R-5775

Property	Specification
Dielectric Constant (Dk)	3.4 (1GHz/23°C); 3.34 (13GHz)
Dissipation Factor (Df)	0.002 (1GHz/23°C); 0.0037 (13GHz)
Coefficient of Thermal Expansion (CTE)	X-axis: 16 ppm/°C; Y-axis: 16 ppm/°C; Z-axis: 45 ppm/°C
Glass Transition Temperature (Tg)	>185°C (DSC method); 210°C (DMA method)
Thermal Decomposition Temperature (Td)	410°C (TGA method)
Layer Support	4-30 layer multilayer PCB designs
Environmental Compliance	RoHS-compliant; Halogen-free
Manufacturing Compatibility	Traditional FR-4 processing (no special equipment required)
Flammability Rating	UL 94 V-0

Typical Applications

This 12-layer Megtron6 PCB is tailored for high-performance, high-frequency systems across industries:

5G Communication: Millimeter-wave antennas, AAU (Active Antenna Unit) RF front-ends, and 5G base station hardware.
Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver-Assistance Systems), and autonomous driving sensors.
Data Centers: High-speed server motherboards, 400G/800G optical module PCBs, and high-bandwidth interconnects.
Aerospace & Defense: Satellite communication systems, high-frequency radar circuits, and avionics.
Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices, and high-performance computing peripherals.

Tags: