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Rogers RT/duroid 5880 PCB Board for Ultra-High-Frequency and Millimeter-Wave Applications with Low Loss

Rogers RT/duroid 5880 PCB Board for Ultra-High-Frequency and Millimeter-Wave Applications with Low Loss

MOQ: 1 stks
Prijs: USD9.99-99.99
Standaardverpakking: Vacuümzakken+dozen
Leveringstermijn: 8-9 werkdagen
Betalingswijze: T/t
Toeleveringskapaciteit: 5000 pcs per maand
Gedetailleerde informatie
Plaats van herkomst
CHINA
Merknaam
Bicheng
Certificering
UL, ISO9001, IATF16949
Modelnummer
BIC-052.v1.0
Basismateriaal:
Rogers RT/duroid 5880
Lagen tellen:
Dubbelzijdig
PCB -dikte:
1,1 mm
PCB -maat:
110 mm × 33,59 mm ± 0,15 mm
Kopergewicht:
1oz (35 μm) voor buitenste lagen
Oppervlakte -afwerking:
onderdompeling goud
Markeren:

Ultra-High-Frequency Rogers PCB Board

,

Millimeter-Wave RF PCB

,

Low Loss High Frequency PCB

Productbeschrijving
Rogers RT/duroid 5880 PCB 2-Layer 1oz Copper 1.1mm Thickness

This document details a high-performance 2-layer rigid printed circuit board (PCB) constructed with Rogers RT/duroid 5880--a PTFE composite reinforced with glass microfibers--engineered for ultra-high-frequency (UHF) to millimeter-wave applications. The PCB leverages the material's exceptional dielectric uniformity and low loss to deliver reliable signal performance, paired with precision manufacturing to meet strict dimensional and electrical standards for RF/microwave systems.

PCB Specifications
Parameter Technical Details Engineering Significance
Base Material Rogers RT/duroid 5880 (PTFE composite reinforced with glass microfibers) Enables ultra-low dielectric loss and uniform Dk, critical for millimeter-wave performance
Layer Count 2-layer rigid configuration Simplifies high-frequency routing (microstrip/stripline) while minimizing interlayer crosstalk
Board Dimensions 110mm × 33.59mm ±0.15mm Ensures precise fit for enclosure integration and automated assembly (e.g., antenna modules)
Minimum Trace/Space 4/6 mils Supports high-density routing of RF signals with controlled impedance and minimal signal coupling
Minimum Hole Size 0.3mm Accommodates fine-pitch thru-hole components (e.g., RF connectors) while maintaining structural integrity
Finished Board Thickness 1.1mm Balances structural rigidity for handling with thin-profile requirements for compact RF designs
Finished Copper Weight 1oz (35μm) for outer layers (no inner layers in 2-layer stackup) Ensures low conductor resistance while minimizing skin-effect losses at high frequencies
Surface Finish Immersion Gold Delivers stable RF contact resistance, excellent corrosion resistance, and reliable solderability for SMT/thru-hole components
Silkscreen White on top layer; no silkscreen on bottom layer Enables component identification without introducing dielectric discontinuities on the signal-critical bottom layer
Solder Mask No solder mask on top or bottom layers Eliminates unwanted dielectric variations that could degrade high-frequency signal propagation
Quality Assurance 100% electrical testing (continuity, isolation, and impedance verification) Confirms compliance with design specs, preventing signal loss or short circuits in field deployment
Stack-up Configuration

The 2-layer stack-up is engineered for optimal microstrip performance and controlled impedance, with a simplified structure tailored to high-frequency applications:

Layer Sequence Material/Component Thickness Function
1 Copper Layer 1 (Top) 35μm Primary signal layer for microstrip traces (e.g., antenna feed lines, RF paths)
2 RT/duroid 5880 Substrate 1.016mm (40mil) Core dielectric layer with tightly controlled Dk for 50Ω/75Ω impedance matching
3 Copper Layer 2 (Bottom) 35μm Ground plane for Layer 1 signals; minimizes EMI and enhances signal shielding
RT/duroid 5880 Key Features

Building on its material properties, RT/duroid 5880 delivers targeted performance features critical for high-frequency PCB design:

  • Precise Dielectric Constant: 2.2 with a tight tolerance of ±0.02 at 10GHz/23°C, ensuring minimal impedance variation across the PCB and consistent signal propagation.
  • Ultra-Low Dissipation Factor: 0.0009 at 10GHz, minimizing signal attenuation even in Ku-band and millimeter-wave (>30GHz) applications.
  • Stable Temperature Coefficient of Dk: TCDk of -125 ppm/°C, maintaining dielectric performance across typical RF operating temperatures (-40°C to +85°C).
  • Minimal Moisture Absorption: 0.02% by weight, preventing dielectric constant drift and material degradation in high-humidity environments.
  • Isotropic Thermal Expansion: CTE of 31 ppm/°C (X-axis), 48 ppm/°C (Y-axis), and 237 ppm/°C (Z-axis), ensuring dimensional stability and reducing trace warpage during thermal cycling.
  • Isotropic Material Structure: Uniform performance in all in-plane directions, critical for symmetric RF designs like microstrip patch antennas.
Rogers RT/duroid 5880 PCB Board for Ultra-High-Frequency and Millimeter-Wave Applications with Low Loss 0
RT/duroid 5880 Material Benefits

The features of RT/duroid 5880 translate to tangible advantages for PCB manufacturing, performance, and application suitability:

  • Uniform Electrical Performance Over Wide Frequencies: Tight Dk tolerance and low Df enable consistent signal integrity from UHF to millimeter waves, eliminating the need for design adjustments across frequency bands.
  • Easy Machinability: Can be cut, sheared, and drilled using standard PCB equipment--unlike other PTFE-based materials that require specialized tools--reducing manufacturing complexity and lead times.
  • Chemical Resistance: Withstands solvents and reagents used in etching, plating, and cleaning processes (both hot and cold), ensuring no material degradation during fabrication.
  • High Reliability in Moist Environments: Low moisture absorption (0.02%) makes it ideal for applications like commercial airline broadband antennas, which operate in humid cabin conditions.
  • Well-Established Industrial Compatibility: A mature material with proven performance in RF/microwave systems, ensuring compatibility with standard component libraries and manufacturing workflows.
  • Lowest Electrical Loss Among Reinforced PTFE Materials: Outperforms other glass-reinforced PTFE laminates in loss reduction, maximizing power efficiency in high-frequency circuits like radar transmitters and power amplifiers.
Manufacturing and Quality Standards
  • Artwork Format: Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring compatibility with all major manufacturing equipment (e.g., laser plotters, drilling machines).
  • Accepted Standard: IPC-Class-2 compliance, guaranteeing reliable performance for commercial RF applications (e.g., point-to-point digital radios, satellite LNBs) with strict quality controls for trace width, hole accuracy, and electrical continuity.
  • Processing Efficiency: RT/duroid 5880's compatibility with FR-4-like processing (no special through-hole treatments) reduces fabrication costs compared to specialized microwave laminates.
Some Typical Applications:
  • Commercial Airline Broadband Antennas
  • Microstrip and Stripline Circuits
  • Millimeter Wave Applications
  • Radar Systems
  • Guidance Systems
  • Point to Point Digital Radio Antennas
Availability

This PCB is available for worldwide shipping, supporting global project needs for RF/microwave equipment--from aerospace (e.g., aircraft antennas) to telecommunications (e.g., 5G base stations).

Conclusion

This PCB combines Rogers' high-performance PTFE composite with precision manufacturing to address the demands of ultra-high-frequency applications. By integrating RT/duroid 5880's uniform dielectric properties, low loss, and easy machinability, the PCB delivers exceptional signal integrity, reliability, and cost-effectiveness--making it a optimal solution for demanding RF/microwave systems.

Rogers RT/duroid 5880 PCB Board for Ultra-High-Frequency and Millimeter-Wave Applications with Low Loss 1
producten
DETAILS VAN DE PRODUCTEN
Rogers RT/duroid 5880 PCB Board for Ultra-High-Frequency and Millimeter-Wave Applications with Low Loss
MOQ: 1 stks
Prijs: USD9.99-99.99
Standaardverpakking: Vacuümzakken+dozen
Leveringstermijn: 8-9 werkdagen
Betalingswijze: T/t
Toeleveringskapaciteit: 5000 pcs per maand
Gedetailleerde informatie
Plaats van herkomst
CHINA
Merknaam
Bicheng
Certificering
UL, ISO9001, IATF16949
Modelnummer
BIC-052.v1.0
Basismateriaal:
Rogers RT/duroid 5880
Lagen tellen:
Dubbelzijdig
PCB -dikte:
1,1 mm
PCB -maat:
110 mm × 33,59 mm ± 0,15 mm
Kopergewicht:
1oz (35 μm) voor buitenste lagen
Oppervlakte -afwerking:
onderdompeling goud
Min. bestelaantal:
1 stks
Prijs:
USD9.99-99.99
Verpakking Details:
Vacuümzakken+dozen
Levertijd:
8-9 werkdagen
Betalingscondities:
T/t
Levering vermogen:
5000 pcs per maand
Markeren

Ultra-High-Frequency Rogers PCB Board

,

Millimeter-Wave RF PCB

,

Low Loss High Frequency PCB

Productbeschrijving
Rogers RT/duroid 5880 PCB 2-Layer 1oz Copper 1.1mm Thickness

This document details a high-performance 2-layer rigid printed circuit board (PCB) constructed with Rogers RT/duroid 5880--a PTFE composite reinforced with glass microfibers--engineered for ultra-high-frequency (UHF) to millimeter-wave applications. The PCB leverages the material's exceptional dielectric uniformity and low loss to deliver reliable signal performance, paired with precision manufacturing to meet strict dimensional and electrical standards for RF/microwave systems.

PCB Specifications
Parameter Technical Details Engineering Significance
Base Material Rogers RT/duroid 5880 (PTFE composite reinforced with glass microfibers) Enables ultra-low dielectric loss and uniform Dk, critical for millimeter-wave performance
Layer Count 2-layer rigid configuration Simplifies high-frequency routing (microstrip/stripline) while minimizing interlayer crosstalk
Board Dimensions 110mm × 33.59mm ±0.15mm Ensures precise fit for enclosure integration and automated assembly (e.g., antenna modules)
Minimum Trace/Space 4/6 mils Supports high-density routing of RF signals with controlled impedance and minimal signal coupling
Minimum Hole Size 0.3mm Accommodates fine-pitch thru-hole components (e.g., RF connectors) while maintaining structural integrity
Finished Board Thickness 1.1mm Balances structural rigidity for handling with thin-profile requirements for compact RF designs
Finished Copper Weight 1oz (35μm) for outer layers (no inner layers in 2-layer stackup) Ensures low conductor resistance while minimizing skin-effect losses at high frequencies
Surface Finish Immersion Gold Delivers stable RF contact resistance, excellent corrosion resistance, and reliable solderability for SMT/thru-hole components
Silkscreen White on top layer; no silkscreen on bottom layer Enables component identification without introducing dielectric discontinuities on the signal-critical bottom layer
Solder Mask No solder mask on top or bottom layers Eliminates unwanted dielectric variations that could degrade high-frequency signal propagation
Quality Assurance 100% electrical testing (continuity, isolation, and impedance verification) Confirms compliance with design specs, preventing signal loss or short circuits in field deployment
Stack-up Configuration

The 2-layer stack-up is engineered for optimal microstrip performance and controlled impedance, with a simplified structure tailored to high-frequency applications:

Layer Sequence Material/Component Thickness Function
1 Copper Layer 1 (Top) 35μm Primary signal layer for microstrip traces (e.g., antenna feed lines, RF paths)
2 RT/duroid 5880 Substrate 1.016mm (40mil) Core dielectric layer with tightly controlled Dk for 50Ω/75Ω impedance matching
3 Copper Layer 2 (Bottom) 35μm Ground plane for Layer 1 signals; minimizes EMI and enhances signal shielding
RT/duroid 5880 Key Features

Building on its material properties, RT/duroid 5880 delivers targeted performance features critical for high-frequency PCB design:

  • Precise Dielectric Constant: 2.2 with a tight tolerance of ±0.02 at 10GHz/23°C, ensuring minimal impedance variation across the PCB and consistent signal propagation.
  • Ultra-Low Dissipation Factor: 0.0009 at 10GHz, minimizing signal attenuation even in Ku-band and millimeter-wave (>30GHz) applications.
  • Stable Temperature Coefficient of Dk: TCDk of -125 ppm/°C, maintaining dielectric performance across typical RF operating temperatures (-40°C to +85°C).
  • Minimal Moisture Absorption: 0.02% by weight, preventing dielectric constant drift and material degradation in high-humidity environments.
  • Isotropic Thermal Expansion: CTE of 31 ppm/°C (X-axis), 48 ppm/°C (Y-axis), and 237 ppm/°C (Z-axis), ensuring dimensional stability and reducing trace warpage during thermal cycling.
  • Isotropic Material Structure: Uniform performance in all in-plane directions, critical for symmetric RF designs like microstrip patch antennas.
Rogers RT/duroid 5880 PCB Board for Ultra-High-Frequency and Millimeter-Wave Applications with Low Loss 0
RT/duroid 5880 Material Benefits

The features of RT/duroid 5880 translate to tangible advantages for PCB manufacturing, performance, and application suitability:

  • Uniform Electrical Performance Over Wide Frequencies: Tight Dk tolerance and low Df enable consistent signal integrity from UHF to millimeter waves, eliminating the need for design adjustments across frequency bands.
  • Easy Machinability: Can be cut, sheared, and drilled using standard PCB equipment--unlike other PTFE-based materials that require specialized tools--reducing manufacturing complexity and lead times.
  • Chemical Resistance: Withstands solvents and reagents used in etching, plating, and cleaning processes (both hot and cold), ensuring no material degradation during fabrication.
  • High Reliability in Moist Environments: Low moisture absorption (0.02%) makes it ideal for applications like commercial airline broadband antennas, which operate in humid cabin conditions.
  • Well-Established Industrial Compatibility: A mature material with proven performance in RF/microwave systems, ensuring compatibility with standard component libraries and manufacturing workflows.
  • Lowest Electrical Loss Among Reinforced PTFE Materials: Outperforms other glass-reinforced PTFE laminates in loss reduction, maximizing power efficiency in high-frequency circuits like radar transmitters and power amplifiers.
Manufacturing and Quality Standards
  • Artwork Format: Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring compatibility with all major manufacturing equipment (e.g., laser plotters, drilling machines).
  • Accepted Standard: IPC-Class-2 compliance, guaranteeing reliable performance for commercial RF applications (e.g., point-to-point digital radios, satellite LNBs) with strict quality controls for trace width, hole accuracy, and electrical continuity.
  • Processing Efficiency: RT/duroid 5880's compatibility with FR-4-like processing (no special through-hole treatments) reduces fabrication costs compared to specialized microwave laminates.
Some Typical Applications:
  • Commercial Airline Broadband Antennas
  • Microstrip and Stripline Circuits
  • Millimeter Wave Applications
  • Radar Systems
  • Guidance Systems
  • Point to Point Digital Radio Antennas
Availability

This PCB is available for worldwide shipping, supporting global project needs for RF/microwave equipment--from aerospace (e.g., aircraft antennas) to telecommunications (e.g., 5G base stations).

Conclusion

This PCB combines Rogers' high-performance PTFE composite with precision manufacturing to address the demands of ultra-high-frequency applications. By integrating RT/duroid 5880's uniform dielectric properties, low loss, and easy machinability, the PCB delivers exceptional signal integrity, reliability, and cost-effectiveness--making it a optimal solution for demanding RF/microwave systems.

Rogers RT/duroid 5880 PCB Board for Ultra-High-Frequency and Millimeter-Wave Applications with Low Loss 1
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