MOQ: | 1 stks |
Prijs: | USD9.99-99.99 |
Standaardverpakking: | Vacuümzakken+dozen |
Leveringstermijn: | 8-9 werkdagen |
Betalingswijze: | T/t |
Toeleveringskapaciteit: | 5000 pcs per maand |
This document details a high-performance 2-layer rigid printed circuit board (PCB) constructed with Rogers RT/duroid 5880--a PTFE composite reinforced with glass microfibers--engineered for ultra-high-frequency (UHF) to millimeter-wave applications. The PCB leverages the material's exceptional dielectric uniformity and low loss to deliver reliable signal performance, paired with precision manufacturing to meet strict dimensional and electrical standards for RF/microwave systems.
Parameter | Technical Details | Engineering Significance |
---|---|---|
Base Material | Rogers RT/duroid 5880 (PTFE composite reinforced with glass microfibers) | Enables ultra-low dielectric loss and uniform Dk, critical for millimeter-wave performance |
Layer Count | 2-layer rigid configuration | Simplifies high-frequency routing (microstrip/stripline) while minimizing interlayer crosstalk |
Board Dimensions | 110mm × 33.59mm ±0.15mm | Ensures precise fit for enclosure integration and automated assembly (e.g., antenna modules) |
Minimum Trace/Space | 4/6 mils | Supports high-density routing of RF signals with controlled impedance and minimal signal coupling |
Minimum Hole Size | 0.3mm | Accommodates fine-pitch thru-hole components (e.g., RF connectors) while maintaining structural integrity |
Finished Board Thickness | 1.1mm | Balances structural rigidity for handling with thin-profile requirements for compact RF designs |
Finished Copper Weight | 1oz (35μm) for outer layers (no inner layers in 2-layer stackup) | Ensures low conductor resistance while minimizing skin-effect losses at high frequencies |
Surface Finish | Immersion Gold | Delivers stable RF contact resistance, excellent corrosion resistance, and reliable solderability for SMT/thru-hole components |
Silkscreen | White on top layer; no silkscreen on bottom layer | Enables component identification without introducing dielectric discontinuities on the signal-critical bottom layer |
Solder Mask | No solder mask on top or bottom layers | Eliminates unwanted dielectric variations that could degrade high-frequency signal propagation |
Quality Assurance | 100% electrical testing (continuity, isolation, and impedance verification) | Confirms compliance with design specs, preventing signal loss or short circuits in field deployment |
The 2-layer stack-up is engineered for optimal microstrip performance and controlled impedance, with a simplified structure tailored to high-frequency applications:
Layer Sequence | Material/Component | Thickness | Function |
---|---|---|---|
1 | Copper Layer 1 (Top) | 35μm | Primary signal layer for microstrip traces (e.g., antenna feed lines, RF paths) |
2 | RT/duroid 5880 Substrate | 1.016mm (40mil) | Core dielectric layer with tightly controlled Dk for 50Ω/75Ω impedance matching |
3 | Copper Layer 2 (Bottom) | 35μm | Ground plane for Layer 1 signals; minimizes EMI and enhances signal shielding |
Building on its material properties, RT/duroid 5880 delivers targeted performance features critical for high-frequency PCB design:
The features of RT/duroid 5880 translate to tangible advantages for PCB manufacturing, performance, and application suitability:
This PCB is available for worldwide shipping, supporting global project needs for RF/microwave equipment--from aerospace (e.g., aircraft antennas) to telecommunications (e.g., 5G base stations).
This PCB combines Rogers' high-performance PTFE composite with precision manufacturing to address the demands of ultra-high-frequency applications. By integrating RT/duroid 5880's uniform dielectric properties, low loss, and easy machinability, the PCB delivers exceptional signal integrity, reliability, and cost-effectiveness--making it a optimal solution for demanding RF/microwave systems.
MOQ: | 1 stks |
Prijs: | USD9.99-99.99 |
Standaardverpakking: | Vacuümzakken+dozen |
Leveringstermijn: | 8-9 werkdagen |
Betalingswijze: | T/t |
Toeleveringskapaciteit: | 5000 pcs per maand |
This document details a high-performance 2-layer rigid printed circuit board (PCB) constructed with Rogers RT/duroid 5880--a PTFE composite reinforced with glass microfibers--engineered for ultra-high-frequency (UHF) to millimeter-wave applications. The PCB leverages the material's exceptional dielectric uniformity and low loss to deliver reliable signal performance, paired with precision manufacturing to meet strict dimensional and electrical standards for RF/microwave systems.
Parameter | Technical Details | Engineering Significance |
---|---|---|
Base Material | Rogers RT/duroid 5880 (PTFE composite reinforced with glass microfibers) | Enables ultra-low dielectric loss and uniform Dk, critical for millimeter-wave performance |
Layer Count | 2-layer rigid configuration | Simplifies high-frequency routing (microstrip/stripline) while minimizing interlayer crosstalk |
Board Dimensions | 110mm × 33.59mm ±0.15mm | Ensures precise fit for enclosure integration and automated assembly (e.g., antenna modules) |
Minimum Trace/Space | 4/6 mils | Supports high-density routing of RF signals with controlled impedance and minimal signal coupling |
Minimum Hole Size | 0.3mm | Accommodates fine-pitch thru-hole components (e.g., RF connectors) while maintaining structural integrity |
Finished Board Thickness | 1.1mm | Balances structural rigidity for handling with thin-profile requirements for compact RF designs |
Finished Copper Weight | 1oz (35μm) for outer layers (no inner layers in 2-layer stackup) | Ensures low conductor resistance while minimizing skin-effect losses at high frequencies |
Surface Finish | Immersion Gold | Delivers stable RF contact resistance, excellent corrosion resistance, and reliable solderability for SMT/thru-hole components |
Silkscreen | White on top layer; no silkscreen on bottom layer | Enables component identification without introducing dielectric discontinuities on the signal-critical bottom layer |
Solder Mask | No solder mask on top or bottom layers | Eliminates unwanted dielectric variations that could degrade high-frequency signal propagation |
Quality Assurance | 100% electrical testing (continuity, isolation, and impedance verification) | Confirms compliance with design specs, preventing signal loss or short circuits in field deployment |
The 2-layer stack-up is engineered for optimal microstrip performance and controlled impedance, with a simplified structure tailored to high-frequency applications:
Layer Sequence | Material/Component | Thickness | Function |
---|---|---|---|
1 | Copper Layer 1 (Top) | 35μm | Primary signal layer for microstrip traces (e.g., antenna feed lines, RF paths) |
2 | RT/duroid 5880 Substrate | 1.016mm (40mil) | Core dielectric layer with tightly controlled Dk for 50Ω/75Ω impedance matching |
3 | Copper Layer 2 (Bottom) | 35μm | Ground plane for Layer 1 signals; minimizes EMI and enhances signal shielding |
Building on its material properties, RT/duroid 5880 delivers targeted performance features critical for high-frequency PCB design:
The features of RT/duroid 5880 translate to tangible advantages for PCB manufacturing, performance, and application suitability:
This PCB is available for worldwide shipping, supporting global project needs for RF/microwave equipment--from aerospace (e.g., aircraft antennas) to telecommunications (e.g., 5G base stations).
This PCB combines Rogers' high-performance PTFE composite with precision manufacturing to address the demands of ultra-high-frequency applications. By integrating RT/duroid 5880's uniform dielectric properties, low loss, and easy machinability, the PCB delivers exceptional signal integrity, reliability, and cost-effectiveness--making it a optimal solution for demanding RF/microwave systems.