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RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

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RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

MOQ:	1 stks
Prijs:	USD9.99-99.99
Standaardverpakking:	Vacuümzakken+dozen
Leveringstermijn:	8-9 werkdagen
Betalingswijze:	T/T
Toeleveringskapaciteit:	5000 pcs per maand

Details Informatie

Productbeschrijving

Gedetailleerde informatie

Plaats van herkomst

China

Merknaam

Bicheng

Certificering

UL, ISO9001, IATF16949

Modelnummer

BIC-332.V1.0

Basismateriaal:

F4BTMS450

Lagen tellen:

4 lagen

PCB -dikte:

1,4 mm

PCB-grootte:

20 mm x 20 mm per eenheid (tolerantie: ±0,15 mm)

Zijdescherm:

Soldermasker:

Kopergewicht:

1oz (1,4 mil / 35μm)

Oppervlakteafwerking:

onderdompeling goud

Markeren:

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

Productbeschrijving

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

This 4-layer rigid PCB uses aerospace-grade F4BTM450 material to deliver superior electrical, thermal, and mechanical performance for high-frequency, mission-critical systems. Meeting IPC-Class-2 standards, it provides a high-reliability solution for aerospace, microwave, and military applications and serves as a competitive alternative to premium imported options.

PCB Specification

Parameter	Specification
Base Material	F4BTMS450 (advanced PTFE-nano-ceramic composite)
Layer Configuration	4-layer rigid PCB
Board Dimensions	20mm x 20mm per unit (tolerance: ±0.15mm)
Finished Board Thickness	1.4mm
Copper Weight (Finished)	1oz (1.4 mils / 35μm)
Via Plating Thickness	20μm
Minimum Trace/Space	4 mils / 5 mils
Minimum Hole Size	0.3mm
Vias	4 total (no blind vias)
Surface Finish	Immersion Gold
Silkscreen	Top: No; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

Precise PCB Stack-up

Copper Layer 1: 35μm (1oz)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 2: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 3: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.762mm (30mil)
Copper Layer 4: 35μm (1oz)

F4BTMS450 Material Advantages

F4BTMS450 is an upgraded iteration of the F4BTM series, featuring a breakthrough formulation of polytetrafluoroethylene (PTFE) resin, ultra-thin/ultra-fine glass fiber cloth, and uniformly distributed special nano-ceramics. Key benefits include:

Minimized electromagnetic wave propagation interference from glass fibers, reducing dielectric loss.
Enhanced dimensional stability and reduced X/Y/Z anisotropy, ensuring consistency across extreme conditions.
Extended usable frequency range, improved electrical strength, and superior thermal conductivity.
Low thermal expansion coefficient and stable dielectric temperature characteristics.
Standard RTF (Reverse Treat Foil) low-roughness copper foil, reducing conductor loss and delivering excellent peel strength (compatible with copper or aluminum bases).

F4BTMS450 Key Electrical & Mechanical Properties

Property	Specification
Dielectric Constant (Dk)	4.5 ±0.09 (10GHz)
Dissipation Factor (Df)	0.0015 (10GHz); 0.0019 (20GHz)
Coefficient of Thermal Expansion (CTE)	X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 45 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk	-58 ppm/°C (-55°C to 150°C)
Flame Rating	UL-94 V0
Thermal Conductivity	0.64 W/MK
Moisture Absorption	0.08% (max)

Typical Applications

This PCB is ideal for demanding environments and high-performance systems, including:

Aerospace equipment, space vehicles, and cabin systems
Microwave and RF (Radio Frequency) devices
Military radar and general radar systems
Feed networks for high-frequency applications
Phase-sensitive antennas and phased array antennas
Satellite communications systems
Other mission-critical electronics requiring stable performance under extreme temperatures and conditions.

Tags:

Producten

MOQ:	1 stks
Prijs:	USD9.99-99.99
Standaardverpakking:	Vacuümzakken+dozen
Leveringstermijn:	8-9 werkdagen
Betalingswijze:	T/T
Toeleveringskapaciteit:	5000 pcs per maand

Gedetailleerde informatie

Productbeschrijving

Gedetailleerde informatie

Plaats van herkomst

China

Merknaam

Bicheng

Certificering

UL, ISO9001, IATF16949

Modelnummer

BIC-332.V1.0

Basismateriaal:

F4BTMS450

Lagen tellen:

4 lagen

PCB -dikte:

1,4 mm

PCB-grootte:

20 mm x 20 mm per eenheid (tolerantie: ±0,15 mm)

Zijdescherm:

Nee

Soldermasker:

Nee

Kopergewicht:

1oz (1,4 mil / 35μm)

Oppervlakteafwerking:

onderdompeling goud

Min. bestelaantal:

1 stks

Prijs:

USD9.99-99.99

Verpakking Details:

Vacuümzakken+dozen

Levertijd:

8-9 werkdagen

Betalingscondities:

T/T

Levering vermogen:

5000 pcs per maand

Markeren

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

Productbeschrijving

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

PCB Specification

Parameter	Specification
Base Material	F4BTMS450 (advanced PTFE-nano-ceramic composite)
Layer Configuration	4-layer rigid PCB
Board Dimensions	20mm x 20mm per unit (tolerance: ±0.15mm)
Finished Board Thickness	1.4mm
Copper Weight (Finished)	1oz (1.4 mils / 35μm)
Via Plating Thickness	20μm
Minimum Trace/Space	4 mils / 5 mils
Minimum Hole Size	0.3mm
Vias	4 total (no blind vias)
Surface Finish	Immersion Gold
Silkscreen	Top: No; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

Precise PCB Stack-up

Copper Layer 1: 35μm (1oz)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 2: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 3: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.762mm (30mil)
Copper Layer 4: 35μm (1oz)

F4BTMS450 Material Advantages

Minimized electromagnetic wave propagation interference from glass fibers, reducing dielectric loss.
Enhanced dimensional stability and reduced X/Y/Z anisotropy, ensuring consistency across extreme conditions.
Extended usable frequency range, improved electrical strength, and superior thermal conductivity.
Low thermal expansion coefficient and stable dielectric temperature characteristics.
Standard RTF (Reverse Treat Foil) low-roughness copper foil, reducing conductor loss and delivering excellent peel strength (compatible with copper or aluminum bases).

F4BTMS450 Key Electrical & Mechanical Properties

Property	Specification
Dielectric Constant (Dk)	4.5 ±0.09 (10GHz)
Dissipation Factor (Df)	0.0015 (10GHz); 0.0019 (20GHz)
Coefficient of Thermal Expansion (CTE)	X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 45 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk	-58 ppm/°C (-55°C to 150°C)
Flame Rating	UL-94 V0
Thermal Conductivity	0.64 W/MK
Moisture Absorption	0.08% (max)

Typical Applications

This PCB is ideal for demanding environments and high-performance systems, including:

Aerospace equipment, space vehicles, and cabin systems
Microwave and RF (Radio Frequency) devices
Military radar and general radar systems
Feed networks for high-frequency applications
Phase-sensitive antennas and phased array antennas
Satellite communications systems
Other mission-critical electronics requiring stable performance under extreme temperatures and conditions.

Tags:

Rf-de Raad van PCB

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PCB-stencil

PCB van de metaalkern

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

1oz RF PCB Board,

1.6mm RF PCB Board,

Rf-de Raad van PCB

De Raad van Rogerspcb

PTFE-de Raad van PCB

Hoge Tg-PCB

Multilaagpcb

Taconic PCB

HDI-de Raad van PCB

Hoge snelheidspcb

Impedantie Gecontroleerde PCB

Flexibele PCB-Raad

fr4 PCB-raad

PCB-stencil

PCB van de metaalkern

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

1oz RF PCB Board,

1.6mm RF PCB Board,